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Vendor |
Device |
Adapter |
Winbond |
W25Q16CL @16SO(300mil) |
ADP-SOIC-2801 |
IC Package : 16 Pin / SOP - (Body Width = 300mil) / Pitch = 1.27 mm |
Size / DataSize / Fuse |
200300hX8 |
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Erase (E) |
4.97 sec |
Blank Check (B) |
1.31 sec |
Program (P) |
8.58 sec |
Verify (V) |
1.31 sec |
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PC System |
Operating System |
Windows 7 x86 |
Processor |
Intel i5-6500 @ 3.2GHz |
Memory |
DDR4 16G |
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