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支援 IC 明細 (全部) |
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" 傳輸介面 " 內含速度測試報告
1. 清除 (E)
2. 空白檢查 (B)
3. 燒錄 (P)
4. 驗證 (V) |
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傳輸介面 |
版本 |
Winbond |
W25Q16DV @24BGA(M4x6) |
ADP-EBGA-2401 |
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1.4 |
Winbond |
W25Q16DV @24BGA(M5x5) |
ADP-EBGA-2402 |
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1.4 |
Winbond |
W25Q16DV @8DIP |
ADP-DIP-001 |
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1.4 |
Winbond |
W25Q16DV @8SO(150mil) |
ADP-SOIC-1601 |
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1.4 |
Winbond |
W25Q16DV @8SO(200mil) |
ADP-SOIC-2001 |
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1.4 |
Winbond |
W25Q16DV @8WSON(5x6) |
ADP-QFN-0801 |
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1.4 |
Winbond |
W25Q16DW @16SO(300mil) |
ADP-SOIC-2801 |
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1.0 |
Winbond |
W25Q16DW @8SO(150mil) |
ADP-SOIC-1601 |
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1.0 |
Winbond |
W25Q16DW @8SO(200mil) |
ADP-SOIC-2001 |
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1.0 |
Winbond |
W25Q16DW @8WSON(5x6) |
ADP-QFN-0801 |
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1.0 |
Winbond |
W25Q16FW @8SO(150mil) |
ADP-SOIC-1601 |
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3.5 |
Winbond |
W25Q16FW @8SO(200mil) |
ADP-SOIC-2001 |
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3.5 |
Winbond |
W25Q16FW @8USON(2x3) |
ADP-QFN-0803 |
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3.5 |
Winbond |
W25Q16FW @8USON(3x4) |
ADP-QFN-0806 |
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3.5 |
Winbond |
W25Q16FW @8WSON(5X6) |
ADP-QFN-0801 |
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3.5 |
5281 - 5295 / 6095
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