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支援 IC 明細 (全部) |
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" 傳輸介面 " 內含速度測試報告
1. 清除 (E)
2. 空白檢查 (B)
3. 燒錄 (P)
4. 驗證 (V) |
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傳輸介面 |
版本 |
Winbond |
W25Q01JV @24BGA(M5x5) |
ADP-EBGA-2402 |
USB
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3.9 |
Winbond |
W25Q01JV @8WSON(6x8) |
ADP-QFN-0802 |
USB
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3.9 |
Winbond |
W25Q01JV-IM @16SO |
ADP-SOIC-2801 |
USB
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4.1 |
Winbond |
W25Q01JV-IM @24BGA(M5x5) |
ADP-EBGA-2402 |
USB
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4.1 |
Winbond |
W25Q01JV-IM @8WSON(6x8) |
ADP-QFN-0802 |
USB
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4.1 |
Winbond |
W25Q01NW-IM @16SO |
ADP-SOIC-2801 |
USB
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4.5 |
Winbond |
W25Q01NW-IM @24BGA(M5x5) |
ADP-EBGA-2402 |
USB
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4.5 |
Winbond |
W25Q01NW-IM @8WSON(6x8) |
ADP-QFN-0802 |
USB
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4.5 |
Winbond |
W25Q01NW-IQ @16SO |
ADP-SOIC-2801 |
USB
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4.5 |
Winbond |
W25Q01NW-IQ @24BGA(M5x5) |
ADP-EBGA-2402 |
USB
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4.5 |
Winbond |
W25Q01NW-IQ @8WSON(6x8) |
ADP-QFN-0802 |
USB
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4.5 |
Winbond |
W25Q02JV-IM @24BGA(M5x5) |
ADP-EBGA-2402 |
USB
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4.4 |
Winbond |
W25Q05CL @8SO(150mil) |
ADP-SOIC-1601 |
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1.1 |
Winbond |
W25Q05CL @8USON(2x3) |
ADP-QFN-0803 |
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1.1 |
Winbond |
W25Q05CL @8WSON(5x6) |
ADP-QFN-0801 |
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1.1 |
5206 - 5220 / 6095
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